Title:
METHOD FOR MANUFACTURING WOODEN BOARD, AND WOODEN BOARD
Document Type and Number:
WIPO Patent Application WO/2015/001702
Kind Code:
A1
Abstract:
A method for manufacturing a wooden board (1) in which at least the surface of a core layer (2) bonded using plant-based chips is provided with a surface layer (3) bonded using plant-based fibers or plant-based chips finer than the plant-based chips of the core layer (2), the surface layer (3) being bonded by an adhesive, wherein the method is characterized in that a petroleum-derived adhesive is used as the adhesive for bonding the plant-based chips of the core layer (2), and a plant-derived adhesive is used as the adhesive for bonding the plant-based chips or fibers of the surface layer (3).
Inventors:
MAEDA NAOHIKO
SUGAWARA RYO
ASADA TEPPEI
MORI KENJI
SUGAWARA RYO
ASADA TEPPEI
MORI KENJI
Application Number:
PCT/JP2014/002802
Publication Date:
January 08, 2015
Filing Date:
May 27, 2014
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
B27N3/00; C09J103/00
Domestic Patent References:
| WO2010001988A1 | 2010-01-07 |
Foreign References:
| JP2005125737A | 2005-05-19 | |||
| JP2013014040A | 2013-01-24 | |||
| JPS57152944A | 1982-09-21 |
Attorney, Agent or Firm:
NISHIZAWA, TOSHIO (JP)
Toshio Nishizawa (JP)
Toshio Nishizawa (JP)
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