Title:
METHOD FOR MOLDING CARRIER TAPE
Document Type and Number:
WIPO Patent Application WO/2018/211862
Kind Code:
A1
Abstract:
The present invention is a method for molding a carrier tape (10) having one or more rows of perforations and accommodating recesses (3) that accommodate components. The method includes a conveying step for conveying a sheet material (10A) to a drum-type mold (120), and a molding step for drawing in the sheet material (10A) that has been conveyed to the surface of the drum-type mold (120) and performing vacuum molding. In the molding step, the sheet material (10A) is vacuum-molded while being heated by the blowing of hot air from a hot-air-heating means (160), and the blowing flow rate of the hot air is at least 0.125 mL/mm2 and no more than 3.75 mL/mm2 per unit area. The present invention makes it possible to provide a method for molding a carrier tape in which the rectangularity of an opening edge of an accommodating recess is ensured.
Inventors:
IMAI MASAYUKI (JP)
SUGIMOTO SHIRO (JP)
SUGIMOTO SHIRO (JP)
Application Number:
PCT/JP2018/015038
Publication Date:
November 22, 2018
Filing Date:
April 10, 2018
Export Citation:
Assignee:
SHINETSU POLYMER CO (JP)
International Classes:
B65B47/10; B29C51/10; B29C51/42; B65B15/04; B65B47/02
Foreign References:
| JPH11207811A | 1999-08-03 | |||
| JPH11151749A | 1999-06-08 | |||
| JP2007126169A | 2007-05-24 |
Attorney, Agent or Firm:
SAKAMOTO Tomohiro (JP)
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