Title:
METHOD FOR PEELING PLATE-SHAPED BASE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2020/255205
Kind Code:
A1
Abstract:
Provided is a method for peeling a plate-shaped base material, with which it is possible for an integrated structure that is integral with the plate-shaped base material to be fabricated efficiently to a prescribed shape. In this method for peeling a plate-shaped base material, a flat surface (105) intersecting a thickness direction (D1) of a plate-shaped base material (104) formed using a metal material is supported by means of a restraining portion (10) in which shear cutting edges (12) are provided in a pair of corner portions (11) that are separated from one another in a surface direction (D2) of the flat surface and that extend parallel to the flat surface. Furthermore, in the method for peeling a plate-shaped base material, cutting edges (20) having a rake angle are moved, between the shear cutting edges in such a way as to intersect the thickness direction, relative to a plate thickness end surface (106) extending in the thickness direction at the edge of the flat surface of the base material, and the flat surface of the base material is partially peeled by the cutting edges having a rake angle, to expose a portion of the base material.
Inventors:
KUROI YUTAKA (JP)
Application Number:
PCT/JP2019/023891
Publication Date:
December 24, 2020
Filing Date:
June 17, 2019
Export Citation:
Assignee:
YOROZU JIDOSHA KOGYO KK (JP)
International Classes:
B21D17/02; B21D19/08
Foreign References:
| JP2014008518A | 2014-01-20 | |||
| JP2015020202A | 2015-02-02 | |||
| CN101612699A | 2009-12-30 |
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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