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Patent Searching and Data


Title:
METHOD OF PLACING PLACEMENT MATERIAL
Document Type and Number:
WIPO Patent Application WO/2005/083184
Kind Code:
A1
Abstract:
A method of placing a placement material for placing the placement material in the foundation and earth floor of a building or a site formed in a road, comprising the steps of leveling the site, laying down plate-like materials in the site, and placing the placement material on the plate-like materials.

Inventors:
KIMISHIMA HIDEHIKO (JP)
YASUDA HIROKAZU (JP)
KAMEDA TETSUJIRO (JP)
MIYAUCHI ISAMU (JP)
NORO AKIRA (JP)
Application Number:
PCT/JP2004/002467
Publication Date:
September 09, 2005
Filing Date:
March 01, 2004
Export Citation:
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Assignee:
JFE CIVIL ENGINEERING & CONSTR (JP)
KIMISHIMA HIDEHIKO (JP)
YASUDA HIROKAZU (JP)
KAMEDA TETSUJIRO (JP)
MIYAUCHI ISAMU (JP)
NORO AKIRA (JP)
International Classes:
E01C7/32; E02D27/01; (IPC1-7): E02D27/01; E01C7/32
Foreign References:
JPH06346463A1994-12-20
JPH1060910A1998-03-03
JPH0885959A1996-04-02
JPH062336A1994-01-11
JPS63223226A1988-09-16
JPH10280429A1998-10-20
JPS6334245U1988-03-05
JP2003082605A2003-03-19
Attorney, Agent or Firm:
Kobayashi, Eiichi (1-7 Hon-cho 6-chom, Funabashi-shi Chiba 05, JP)
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