Title:
METHOD OF PLACING PLACEMENT MATERIAL
Document Type and Number:
WIPO Patent Application WO/2005/083184
Kind Code:
A1
Abstract:
A method of placing a placement material for placing the placement material in the foundation and earth floor of a building or a site formed in a road, comprising the steps of leveling the site, laying down plate-like materials in the site, and placing the placement material on the plate-like materials.
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Inventors:
KIMISHIMA HIDEHIKO (JP)
YASUDA HIROKAZU (JP)
KAMEDA TETSUJIRO (JP)
MIYAUCHI ISAMU (JP)
NORO AKIRA (JP)
YASUDA HIROKAZU (JP)
KAMEDA TETSUJIRO (JP)
MIYAUCHI ISAMU (JP)
NORO AKIRA (JP)
Application Number:
PCT/JP2004/002467
Publication Date:
September 09, 2005
Filing Date:
March 01, 2004
Export Citation:
Assignee:
JFE CIVIL ENGINEERING & CONSTR (JP)
KIMISHIMA HIDEHIKO (JP)
YASUDA HIROKAZU (JP)
KAMEDA TETSUJIRO (JP)
MIYAUCHI ISAMU (JP)
NORO AKIRA (JP)
KIMISHIMA HIDEHIKO (JP)
YASUDA HIROKAZU (JP)
KAMEDA TETSUJIRO (JP)
MIYAUCHI ISAMU (JP)
NORO AKIRA (JP)
International Classes:
E01C7/32; E02D27/01; (IPC1-7): E02D27/01; E01C7/32
Foreign References:
JPH06346463A | 1994-12-20 | |||
JPH1060910A | 1998-03-03 | |||
JPH0885959A | 1996-04-02 | |||
JPH062336A | 1994-01-11 | |||
JPS63223226A | 1988-09-16 | |||
JPH10280429A | 1998-10-20 | |||
JPS6334245U | 1988-03-05 | |||
JP2003082605A | 2003-03-19 |
Attorney, Agent or Firm:
Kobayashi, Eiichi (1-7 Hon-cho 6-chom, Funabashi-shi Chiba 05, JP)
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