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Patent Searching and Data


Title:
METHOD FOR POLISHING SUBSTRATE, AND POLISHING COMPOSITION SET
Document Type and Number:
WIPO Patent Application WO/2019/017407
Kind Code:
A1
Abstract:
Provided is a method for polishing a substrate, the method being capable of efficiently achieving a surface having high flatness and few defects. This method for polishing a substrate comprises a plurality of pre-polishing steps in which a first polishing liquid, a second polishing liquid, and a third polishing liquid are supplied in this order in a process for pre-polishing the substrate. The content COMP1 of water-soluble polymer P1 in the first polishing liquid, the content COMP 2 of water-soluble polymer P2 in the second polishing liquid, and the content COMP 3 of water-soluble polymer P3 in the third polishing liquid satisfy the relation of COMP1

Inventors:
TABATA MAKOTO (JP)
Application Number:
PCT/JP2018/026976
Publication Date:
January 24, 2019
Filing Date:
July 18, 2018
Export Citation:
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Assignee:
FUJIMI INC (JP)
International Classes:
H01L21/304; B24B37/00; C09G1/02; C09K3/14
Domestic Patent References:
WO2012002525A12012-01-05
Foreign References:
JP2015185672A2015-10-22
JP2010021487A2010-01-28
JP2017141762A2017-08-17
JP2003257906A2003-09-12
JP2014103398A2014-06-05
JP2001239452A2001-09-04
Other References:
See also references of EP 3657533A4
Attorney, Agent or Firm:
ABE, Makoto (JP)
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