Title:
METHOD FOR POLISHING TARGET MATERIAL, METHOD FOR PRODUCING TARGET MATERIAL, AND METHOD FOR PRODUCING RECYCLED INGOT
Document Type and Number:
WIPO Patent Application WO/2020/196281
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a method for polishing a target material, whereby it becomes possible to remove a bonding material from the target material and to reduce the clogging in a polishing material. The method for polishing a target material according to the present invention is a method for polishing a target material separated from a sputtering target formed by bonding the target material to a support member with a bonding material, the method comprising polishing a bonding surface of the target material, i.e., a surface of the target material which has been bonded to the support member, with a polishing material which comprises a plurality of block bodies each composed of a grind stone, wherein the plurality of block bodies are arranged on a single plane in such a manner that adjacent two block bodies are separated from each other with a gap space interposed therebetween.
Inventors:
NISHIOKA KOJI (JP)
TSUKADA HIROYUKI (JP)
TOKUNAGA NAOKI (JP)
TSUKADA HIROYUKI (JP)
TOKUNAGA NAOKI (JP)
Application Number:
PCT/JP2020/012335
Publication Date:
October 01, 2020
Filing Date:
March 19, 2020
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
C23C14/34; B24B21/12; B24B23/06; B24D7/06; B24D11/00; B24D11/06
Foreign References:
| JP2002120155A | 2002-04-23 | |||
| JP2005533670A | 2005-11-10 | |||
| JPH05253852A | 1993-10-05 | |||
| JPH0615571A | 1994-01-25 | |||
| JPH08206964A | 1996-08-13 | |||
| JPS58223567A | 1983-12-26 | |||
| JPS5783350A | 1982-05-25 | |||
| JP2018172796A | 2018-11-08 |
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (JP)
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