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Patent Searching and Data


Title:
METHOD FOR POLISHING TO-BE-POLISHED OBJECT INCLUDING MATERIAL HAVING SILICON-SILICON BOND
Document Type and Number:
WIPO Patent Application WO/2020/195149
Kind Code:
A1
Abstract:
The present invention provides a method for polishing a to-be-polished object including a material having a silicon-silicon bond, the method comprising a means for achieving reduction in both the number of defects and haze to a great extent for the polished object after being polished. The present invention pertains to a method for polishing a to-be-polished object including a material having a silicon-silicon bond, the method being provided with a finishing polishing process Pf wherein: the finishing polishing process Pf includes a plurality of polishing steps; the plurality of polishing steps are performed continuously on the same polishing plate; the final step of the plurality of polishing steps is a polishing step Pff for performing polishing by using a polishing composition Sff; a polishing step before the polishing step Pff in the plurality of polishing steps is a polishing step Pfp for performing polishing by using a polishing composition Sfp; and the polishing composition Sff satisfies the following condition (A) and/or condition (B). Condition (A): A haze parameter value obtained by a standard test 1 for the polishing composition Sff is less than a haze parameter value obtained by a standard test 1 for the polishing composition Sfp. Condition (B): The polishing composition Sff contains abrasive grains Aff, a basic compound Bff, and hydroxyethyl cellulose.

Inventors:
TSUCHIYA KOHSUKE (JP)
ASADA MAKI (JP)
MOMOTA SATOSHI (JP)
Application Number:
PCT/JP2020/003548
Publication Date:
October 01, 2020
Filing Date:
January 30, 2020
Export Citation:
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Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Foreign References:
JP2016004953A2016-01-12
JP2011097045A2011-05-12
JP2019021719A2019-02-07
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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