Title:
METHOD FOR PREPARING FLEXIBLE INSULATION BOARD AND FLEXIBLE INSULATION BOARD OBTAINED USING SAME, FLEXIBLE LAMINATE AND METHOD FOR PREPARING SAME, AND APPLICATION
Document Type and Number:
WIPO Patent Application WO/2022/110389
Kind Code:
A1
Abstract:
The present invention provides a method for preparing a flexible insulation board and a flexible insulation board obtained using same, a flexible laminate and a method for preparing same, and an application. The method for preparing a flexible insulation board comprises the following process: impregnating an ultra-thin fiber layer having a thickness of 8 µm to 25 µm with a glue solution of a first fluorine resin, and carrying out first curing to obtain a prepreg; coating two sides of the prepreg with a glue solution of a second fluorine resin or spraying a glue solution of a second fluorine resin onto two sides of the prepreg, carrying out second curing, and repeating the coating or spraying and the curing until the total mass percentage of the first fluorine resin and the second fluorine resin is 60% to 95%, thereby obtaining a semi-finished product; carrying out heat treatment on the semi-finished product to obtain a fiber reinforced fluorine resin layer; and laminating one fiber reinforced fluorine resin layer, two fiber reinforced fluorine resin layers or more than two fiber reinforced fluorine resin layers and carrying out press-fit molding to obtain a flexible insulation board. The flexible insulation board and the flexible laminate provided in the present invention have the characteristics of low dielectric loss, small thickness, good flexibility and the like, and have significant prospects for application in future high-frequency miniaturized devices.
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Inventors:
WANG HONGYUAN (CN)
ZHANG YILAN (CN)
WANG HEZHI (CN)
ZHANG YILAN (CN)
WANG HEZHI (CN)
Application Number:
PCT/CN2020/137499
Publication Date:
June 02, 2022
Filing Date:
December 18, 2020
Export Citation:
Assignee:
AAC ACOUSTIC TECH SHENZHEN CO LTD (CN)
AAC MODULE ELECTRONIC SHUYANG CO LTD (CN)
AAC MODULE ELECTRONIC SHUYANG CO LTD (CN)
International Classes:
B32B27/04; B32B15/08; B32B27/08; B32B27/20; B32B27/28; B32B33/00; B32B37/10; B32B38/08; B32B38/18; H05K1/03
Foreign References:
| CN106633785A | 2017-05-10 | |||
| CN103429423A | 2013-12-04 | |||
| CN104553224A | 2015-04-29 | |||
| CN105437671A | 2016-03-30 | |||
| CN106696398A | 2017-05-24 | |||
| CN107385936A | 2017-11-24 |
Attorney, Agent or Firm:
SHENZHEN CIPRUN INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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