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Patent Searching and Data


Title:
METHOD FOR PREPARING METAL THIN FILM MOLD HAVING SURFACE MICRO-NANO STRUCTURE, AND INTERMEDIATE OF METAL THIN FILM MOLD
Document Type and Number:
WIPO Patent Application WO/2019/084770
Kind Code:
A1
Abstract:
Provided are a method for preparing a metal thin film mold having a surface micro-nano structure, and an intermediate of a metal thin film mold. The method comprises: providing a template having a surface micro-nano structure; forming a first anti-stick metal layer with a nano-scale thickness on the surface of the surface micro-nano structure of the template by means of first physical vapor deposition, wherein the first anti-stick metal layer and the template have a first binding force; and forming a first electroplated metal layer with a micron-scale thickness on the first anti-stick metal layer by means of first electroplating, wherein the first electroplated metal layer and the first anti-stick metal layer have a second binding force, the first binding force is smaller than the second binding force, and the first anti-stick metal layer also acts as a conducting layer in the first electroplating step. The method of the present invention can perfectly copy the three-dimensional surface micro-nano structure of the template, thereby obtaining a metal thin film mold having a desired surface micro-nano structure.

Inventors:
FAN ZHIYONG (CN)
TANG LEI (CN)
TSUI KWONG HOI (CN)
Application Number:
PCT/CN2017/108575
Publication Date:
May 09, 2019
Filing Date:
October 31, 2017
Export Citation:
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Assignee:
UNIV HONG KONG SCI & TECH (CN)
International Classes:
B29C33/38; B29C59/02
Foreign References:
CN102612424A2012-07-25
CN1843768A2006-10-11
CN101910942A2010-12-08
CN102621804A2012-08-01
JP2015027798A2015-02-12
Attorney, Agent or Firm:
TEE&HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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