Title:
METHOD FOR PROCESSING ELECTRONIC/ELECTRICAL DEVICE COMPONENT SCRAPS
Document Type and Number:
WIPO Patent Application WO/2020/203918
Kind Code:
A1
Abstract:
Provided is a method for processing electronic/electrical device component scraps, the method enabling an improvement in the efficiency of sorting, from electronic/electrical device component scraps, a raw material to be fed in a smelting step and enabling reduction of losses of valuable metals. The method for processing electronic/electrical device component scraps is characterized by removing powdery substances included in electronic/electrical device component scraps before a separation step for separating non-metallic materials or metallic materials from the electronic/electrical device component scraps including the metallic materials and the non-metallic materials using a metal sorter provided with a metal sensor, a color camera, an air valve, and a conveyor.
Inventors:
AOKI KATSUSHI (JP)
SASAOKA HIDETOSHI (JP)
TAKEDA TSUBASA (JP)
SASAOKA HIDETOSHI (JP)
TAKEDA TSUBASA (JP)
Application Number:
PCT/JP2020/014367
Publication Date:
October 08, 2020
Filing Date:
March 27, 2020
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
B07B7/00; B03B4/00; B09B5/00
Domestic Patent References:
| WO2012131906A1 | 2012-10-04 | |||
| WO2019177177A1 | 2019-09-19 | |||
| WO2019177176A1 | 2019-09-19 | |||
| WO2019151351A1 | 2019-08-08 |
Foreign References:
| JP2007029923A | 2007-02-08 | |||
| JPH1057927A | 1998-03-03 | |||
| JP2002194448A | 2002-07-10 | |||
| JP2013000685A | 2013-01-07 | |||
| JP2018167246A | 2018-11-01 | |||
| JP2018079459A | 2018-05-24 | |||
| JP2002263581A | 2002-09-17 | |||
| JP2019048282A | 2019-03-28 | |||
| JP2008142692A | 2008-06-26 | |||
| JPH0978151A | 1997-03-25 | |||
| JP2015123418A | 2015-07-06 |
Other References:
See also references of EP 3950153A4
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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