Title:
METHOD FOR PRODUCING BONDED BODY, BONDED BODY, AND HOT MELT ADHESIVE SHEET CONTAINING ELECTROCONDUCTIVE PARTICLES
Document Type and Number:
WIPO Patent Application WO/2021/246482
Kind Code:
A1
Abstract:
Provided are a method for producing a bonded body capable of obtaining exceptional adhesive strength and connection reliability, a bonded body, and a hot melt adhesive sheet containing electroconductive particles. A method for producing a bonded body in which: a first electronic component and a second electronic component are thermocompression bonded via a hot melt adhesive sheet containing electroconductive particles, where the hot melt adhesive sheet contains electroconductive particles in a binder including a crystalline polyamide resin and a crystalline polyester resin; and a conductive part (11) of the first electronic component (10) and a conductive part (21) of the second electronic component (20) are connected, wherein the ratio of the melt viscosity at a temperature that is less than the thermocompression bonding temperature by 20°C to the melt viscosity at the thermocompression bonding temperature, when the melt viscosity of the hot melt adhesive sheet containing electroconductive particles is measured at a temperature elevation rate of 5°C/min, is 10 or higher.
Inventors:
KUMAKURA HIROYUKI (JP)
ABE TOMOYUKI (JP)
ABE TOMOYUKI (JP)
Application Number:
PCT/JP2021/021180
Publication Date:
December 09, 2021
Filing Date:
June 03, 2021
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
C09J5/06; C09J7/35; C09J9/02; C09J11/04; C09J167/00; C09J177/00; H01B1/00; H01B1/22; H01B5/16; H01R11/01; H01R43/00
Foreign References:
| JP2014026963A | 2014-02-06 | |||
| JP2014017248A | 2014-01-30 | |||
| JP2020033427A | 2020-03-05 | |||
| JP2018135422A | 2018-08-30 | |||
| JP2014060025A | 2014-04-03 | |||
| JP2020098843A | 2020-06-25 | |||
| JP5964187B2 | 2016-08-03 | |||
| JP2017117468A | 2017-06-29 |
Attorney, Agent or Firm:
NOGUCHI, Nobuhiro (JP)
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