Title:
METHOD FOR PRODUCING CIRCUIT BOARD, CIRCUIT BOARD, METHOD FOR PRODUCING MOLDED ARTICLE, AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2021/106713
Kind Code:
A1
Abstract:
This method for producing a circuit board involves: a first positioning step for positioning a first resist material 200 on a substrate 10; a first curing step for forming a first resist layer 20 by curing the first resist material 200; a first formation step for forming an overcoat layer 70 on a release film 80; a second formation step for forming first and second conductive parts 41, 61 on the overcoat layer 70; a second positioning step for positioning a second resist material 300 on the overcoat layer 70 so as to cover the first and second conductive parts 41, 61; a second curing step for forming a second resist layer 30 by curing the second resist material 300; a joining step for joining the first and second resist layers 20, 30 to one another; a thermocompression bonding step for thermocompression-bonding the first and second resist layers 20, 30 after the joining step; and a separation step for separating the release film 80.
Inventors:
KOSHIMIZU KAZUTOSHI (JP)
Application Number:
PCT/JP2020/042995
Publication Date:
June 03, 2021
Filing Date:
November 18, 2020
Export Citation:
Assignee:
FUJIKURA LTD (JP)
International Classes:
B29D7/00; B29C65/02; B32B37/02; H05K3/00; H05K3/20; H05K3/28; H05K3/46
Foreign References:
| JP2018148150A | 2018-09-20 | |||
| JPH077242A | 1995-01-10 | |||
| JP2019137070A | 2019-08-22 | |||
| JPH0739230B2 | 1995-05-01 | |||
| JPH1051108A | 1998-02-20 | |||
| JP2018142750A | 2018-09-13 |
Attorney, Agent or Firm:
TOKOSHIE PATENT FIRM (JP)
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