Title:
METHOD FOR PRODUCING COMPOSITE PREFORM AND SYNTHETIC RESIN CONTAINER
Document Type and Number:
WIPO Patent Application WO/2021/065705
Kind Code:
A1
Abstract:
The present invention provides a method for producing a composite preform, said method comprising a primary injection step for injection molding a preform main body with use of a primary mold and a secondary injection step for injection molding a cover layer with use of a secondary mold, said cover layer covering the preform main body in such a manner that an end part thereof reaches the peripheral edge of a neck ring, while covering the lower surface of the neck ring, wherein the cover layer is provided with an easily tearable part by providing the inner circumferential surface of the secondary mold with a projected part that is in contact with or in the vicinity of the lower surface of the neck ring, while extending in the axial direction in a predetermined length.
The present invention also provides a synthetic resin container which comprises a cover layer that covers portions other than a portion on the mouth part side in such a manner that an end part thereof reaches the peripheral edge of a neck ring, while covering the lower surface of the neck ring, and which is provided with an easily tearable part in the cover layer. Consequently, the synthetic resin container according to the present invention is provided with a cover layer on the surface of a container man body, said cover layer covering the entirety of the container except for a portion on the mouth part side; and the cover layer is easily separated from the container main body after use.
Inventors:
KIYOTO HIROMITSU (JP)
INAGAKI HAJIME (JP)
MONZEN HIDETO (JP)
YASUKAWA HIROKI (JP)
INAGAKI HAJIME (JP)
MONZEN HIDETO (JP)
YASUKAWA HIROKI (JP)
Application Number:
PCT/JP2020/036235
Publication Date:
April 08, 2021
Filing Date:
September 25, 2020
Export Citation:
Assignee:
TOYO SEIKAN KAISHA LTD (JP)
International Classes:
B29B11/08; B29C45/16; B29C49/06; B65D1/02
Foreign References:
| JPH1190975A | 1999-04-06 | |||
| JPS60201909A | 1985-10-12 | |||
| JP2019077114A | 2019-05-23 | |||
| JP2010064771A | 2010-03-25 | |||
| JPH06263132A | 1994-09-20 |
Attorney, Agent or Firm:
HEIWA INTERNATIONAL PATENT OFFICE (JP)
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