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Patent Searching and Data


Title:
METHOD FOR PRODUCING CONDUCTIVE PATTERN AND METHOD FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/181016
Kind Code:
A1
Abstract:
A method for producing a conductive pattern according to the present disclosure comprises a formation step 1, a formation step 2, a light exposure step, a removal step 1 and a removal step 2. In the formation step 1, a conducive layer that contains a metal nanomaterial and a resin is formed on a part or the entirety of the surface of a supporting body. In the formation step 2, a photosensitive resin layer is formed on the conductive layer. In the light exposure step, the photosensitive resin layer is subjected to light exposure. In the removal step 1, a resin pattern is formed by removing unnecessary portions from the light-exposed photosensitive resin layer. In the removal step 2, a conductive pattern is obtained by removing the conductive layer in portions where the resin pattern is not formed. A method for producing an electronic device according to the present disclosure is provided with a conductive pattern which is obtained by the above-described method for producing a conductive pattern.

Inventors:
KATAYAMA AKIO (JP)
MOROZUMI KAZUMASA (JP)
SATO MORIMASA (JP)
Application Number:
PCT/JP2021/047450
Publication Date:
September 01, 2022
Filing Date:
December 21, 2021
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
B05D1/36; B05D3/06; B05D3/10; B05D3/12; B05D5/12; B05D7/24; C09D11/52; G03F7/004; G03F7/033; H05K3/00; H05K3/02; H05K3/06
Domestic Patent References:
WO2016167228A12016-10-20
WO2018179640A12018-10-04
Foreign References:
JP2022032022A2022-02-24
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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