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Title:
METHOD FOR PRODUCING CONDUCTOR PLATE, CONDUCTOR PLATE, AND CONDUCTOR PLATE ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2023/139697
Kind Code:
A1
Abstract:
This method for producing a conductor plate includes: a pressing step for forming a prescribed closed region through press molding and then cutting out a prescribed region being folded in the closed region from the surroundings so as to leave only a connected part, which is part of the region being folded; and a folding step for folding the region being folded at the connected part to thereby laminate the region being folded with a region being laminated, which is another region in the closed region, and expanding part of the region being folded to outside of the closed region.

Inventors:
OHASHI KATSUHIDE (JP)
Application Number:
PCT/JP2022/001818
Publication Date:
July 27, 2023
Filing Date:
January 19, 2022
Export Citation:
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Assignee:
HITACHI ASTEMO LTD (JP)
International Classes:
B21D28/26; B21D53/00; H01P1/36; H01P1/383; H01P11/00; H01R4/58; H01R43/16
Foreign References:
JP2001024406A2001-01-26
JP2011086446A2011-04-28
JPS53122792A1978-10-26
JP2020166944A2020-10-08
JP2002281645A2002-09-27
Attorney, Agent or Firm:
SUNNEXT INTERNATIONAL PATENT OFFICE (JP)
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