Title:
METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING MULTILAYER BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND TREATMENT SOLUTION AND RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/032475
Kind Code:
A1
Abstract:
A purpose of the present invention is to provide a method for producing a cured product whereby a cured product having excellent breaking elongation, a method for producing a multilayer body including said method for producing a cured product, and a method for producing a semiconductor device including said method for producing a cured product or said method for producing a multilayer body. It is also a purpose of the present invention to provide a treatment solution and a resin composition used in the method for producing a cured product. The method for producing a cured product includes a film forming step of applying a resin composition including a precursor of a cyclic resin and a polymerizable compound having a urea bond to a base material to form a film, a treatment step of causing a treatment solution and the film to make contact, and a heating step of heating the film after the treatment step, wherein the treatment solution includes at least one type of compound selected from the group consisting of basic compounds and base generators.
Inventors:
NOZAKI ATSUYASU (JP)
TAKASHIMA MISAKI (JP)
NAKAMURA ATSUSHI (JP)
TAKASHIMA MISAKI (JP)
NAKAMURA ATSUSHI (JP)
Application Number:
PCT/JP2022/027411
Publication Date:
March 09, 2023
Filing Date:
July 12, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H01L21/312; C08G73/10; G03F7/32; G03F7/40
Domestic Patent References:
| WO2020255825A1 | 2020-12-24 |
Foreign References:
| JPH08339089A | 1996-12-24 | |||
| JP2000330297A | 2000-11-30 | |||
| JPH08211629A | 1996-08-20 | |||
| JPH11233949A | 1999-08-27 | |||
| JPH03194559A | 1991-08-26 | |||
| JP2018004909A | 2018-01-11 | |||
| JP2021026053A | 2021-02-22 |
Attorney, Agent or Firm:
YONEKURA Junzo et al. (JP)
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