Title:
METHOD FOR PRODUCING PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/167077
Kind Code:
A1
Abstract:
This method for producing a photosensitive resin composition, which contains a precursor that has an amide bond, while having a repeating unit represented by general formula (1), is characterized by comprising a step wherein an activated carboxylic acid is obtained by activating a carboxylic acid compound represented by general formula (2) and a step wherein the precursor that has an amide bond is obtained by having an amine compound represented by general formula (3) act on the activated carboxylic acid. This method is also characterized in that at least one of the step wherein an activated carboxylic acid is obtained and the step wherein a precursor that has an amide bond is obtained is carried out in a solvent that contains a heterocyclic compound having a carbonyl group.
Inventors:
HIROSAWA RYUJI (JP)
SUZUKI SAKIKO (JP)
KITAHATA TARO (JP)
HORII MAKOTO (JP)
SUZUKI SAKIKO (JP)
KITAHATA TARO (JP)
HORII MAKOTO (JP)
Application Number:
PCT/JP2021/006410
Publication Date:
August 26, 2021
Filing Date:
February 19, 2021
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
G03F7/023; C08G69/36
Domestic Patent References:
| WO2014115233A1 | 2014-07-31 | |||
| WO2017217293A1 | 2017-12-21 |
Foreign References:
| JP2017125210A | 2017-07-20 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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