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Patent Searching and Data


Title:
METHOD FOR PRODUCING RESIN COMPOSITION LAYER, RESIN COMPOSITION LAYER PRODUCED BY SAID PRODUCTION METHOD, AND COMPOSITE MOLDED ARTICLE INCLUDING SAID RESIN COMPOSITION LAYER
Document Type and Number:
WIPO Patent Application WO/2021/206038
Kind Code:
A1
Abstract:
A method for producing a resin composition layer which comprises a resin composition comprising an agglomerated inorganic filler and a heat-curable resin, the method comprising the following steps (a) and (b). (a) A step for subjecting a carrier film and a sheet formed on the carrier film using the resin composition to a press treatment under the condition of a press temperature of 0 to 110°C, inclusive, and a press pressure of 40 to 1000 MPa, inclusive; and (b) a step for subjecting the sheet that has been undergone the step (a) to a press treatment under the condition of a press temperature of 70 to 250°C, inclusive, and a press pressure of 3 to 100 MPa, inclusive, to produce a resin composition layer.

Inventors:
SAWAMURA TOSHIYUKI (JP)
KOGA YUUYA (JP)
TANAKA TOSHIYUKI (JP)
WATANABE AKIRA (JP)
Application Number:
PCT/JP2021/014448
Publication Date:
October 14, 2021
Filing Date:
April 05, 2021
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C08K7/00; B29C43/14; C08J5/18; C08K3/013; C08L101/00; C09K5/14
Attorney, Agent or Firm:
SHIGENO, Tsuyoshi et al. (JP)
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