Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD FOR PRODUCING RESIN MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2017/086184
Kind Code:
A1
Abstract:
According to this method for producing a resin molded body, a thermosetting resin member (10) is formed by completing the curing of a thermosetting resin material, which is the starting material of the thermosetting resin member, by means of heating. By irradiating a sealing surface (11) of the thermosetting resin member with a laser, a surface layer (13) that is positioned in the outermost surface of the sealing surface is removed, thereby forming at least a part of the sealing surface into a nascent surface (14) where a functional group is present. By injection molding, as a thermoplastic resin material serving as the starting material for a thermoplastic resin member (20), a material, into which an additive (20a) containing a functional group that is chemically bonded with the functional group present in the nascent surface is added, onto the thermosetting resin member having the thus-formed nascent surface, the sealing surface of the thermosetting resin member is sealed with the thermoplastic resin member, while having the functional group present in the nascent surface and the functional group present in the additive that is added into the thermoplastic resin material chemically bond with each other. A member having an absorptance of laser light used for the laser irradiation of 10% or more per 1 μm is used as the thermosetting resin member.

More Like This:
Inventors:
MORI HODAKA (JP)
IZUMI RYOSUKE (JP)
YAMAKAWA HIROYUKI (JP)
KUROKAWA MOTOMI (JP)
YOSHIDA NORIHITO (JP)
Application Number:
PCT/JP2016/082745
Publication Date:
May 26, 2017
Filing Date:
November 04, 2016
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DENSO CORP (JP)
International Classes:
B29C65/00; B29C69/00; H01L21/56; H01L23/29; H01L23/31
Domestic Patent References:
WO2015129237A12015-09-03
WO2006109480A12006-10-19
Attorney, Agent or Firm:
JIN Shunji (JP)
Download PDF: