Title:
METHOD FOR PRODUCING SEMICONDUCTOR WAFERS USING A WIRE SAW, WIRE SAW, AND SEMICONDUCTOR WAFERS MADE OF MONOCRYSTALLINE SILICON
Document Type and Number:
WIPO Patent Application WO/2020/126787
Kind Code:
A3
Abstract:
The invention relates to a method for producing semiconductor wafers from a workpiece by machining the workpiece using a wire saw, to a wire saw, and to semiconductor wafers made of monocrystalline silicon. The method has the steps of feeding the workpiece through an assembly of wires which are stretched between wire guide rollers in a divided manner in wire groups and which run in a running direction; producing cutting gaps when engaging the wires into the workpiece; ascertaining an incorrect position of the cutting gaps of the wire groups for each wire group; and, for each wire group, carrying out compensating movements of the wires of the wire group in a direction perpendicular to the running direction of the wires of the wire group on the basis of the ascertained incorrect position of the cutting gaps of the wire group when feeding the workpiece through the assembly of wires by activating at least one drive element.
Inventors:
BEYER AXEL (DE)
WELSCH STEFAN (DE)
WELSCH STEFAN (DE)
Application Number:
PCT/EP2019/084802
Publication Date:
December 30, 2020
Filing Date:
December 12, 2019
Export Citation:
Assignee:
SILTRONIC AG (DE)
International Classes:
B28D5/00; B23D59/00; B28D5/04; H01L21/02
Foreign References:
| JPH11165251A | 1999-06-22 | |||
| DE112016005417T5 | 2018-08-02 | |||
| US20150004799A1 | 2015-01-01 | |||
| US20080166948A1 | 2008-07-10 |
Attorney, Agent or Firm:
STAUDACHER, Wolfgang (DE)
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