Title:
METHOD FOR PRODUCING THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN COMPOSITION, AND ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/149594
Kind Code:
A1
Abstract:
A method for producing a thermosetting resin composition according to the present invention comprises a primary kneading in which a thermosetting resin is kneaded, and a secondary kneading in which, after the primary kneading, a curing agent is added and further kneading is performed.
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Inventors:
KANG DONGCHUL (JP)
YAMAURA MASASHI (JP)
NAKAMURA TAKEHIRO (JP)
NOZAWA HIROSHI (JP)
HONG CHANGHOON (JP)
HIRAJIMA KATSUYUKI (JP)
YAMAURA MASASHI (JP)
NAKAMURA TAKEHIRO (JP)
NOZAWA HIROSHI (JP)
HONG CHANGHOON (JP)
HIRAJIMA KATSUYUKI (JP)
Application Number:
PCT/JP2022/000210
Publication Date:
July 14, 2022
Filing Date:
January 06, 2022
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
H01L23/29; B29B7/88; C08K3/013; C08L63/00; C08L101/00; H01L23/31
Foreign References:
JP2002179807A | 2002-06-26 | |||
JPH0853532A | 1996-02-27 | |||
JP2009127012A | 2009-06-11 | |||
JP2004346101A | 2004-12-09 | |||
JP2020145424A | 2020-09-10 | |||
JPH03211A | 1991-01-07 | |||
JP2003160642A | 2003-06-03 | |||
JP2009203292A | 2009-09-10 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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