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Title:
METHOD FOR PRODUCING THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN COMPOSITION, AND ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/149594
Kind Code:
A1
Abstract:
A method for producing a thermosetting resin composition according to the present invention comprises a primary kneading in which a thermosetting resin is kneaded, and a secondary kneading in which, after the primary kneading, a curing agent is added and further kneading is performed.

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Inventors:
KANG DONGCHUL (JP)
YAMAURA MASASHI (JP)
NAKAMURA TAKEHIRO (JP)
NOZAWA HIROSHI (JP)
HONG CHANGHOON (JP)
HIRAJIMA KATSUYUKI (JP)
Application Number:
PCT/JP2022/000210
Publication Date:
July 14, 2022
Filing Date:
January 06, 2022
Export Citation:
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Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
H01L23/29; B29B7/88; C08K3/013; C08L63/00; C08L101/00; H01L23/31
Foreign References:
JP2002179807A2002-06-26
JPH0853532A1996-02-27
JP2009127012A2009-06-11
JP2004346101A2004-12-09
JP2020145424A2020-09-10
JPH03211A1991-01-07
JP2003160642A2003-06-03
JP2009203292A2009-09-10
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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