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Patent Searching and Data


Title:
METHOD FOR PRODUCING THERMOSETTING RESIN COMPOSITION AND METHOD FOR PRODUCING ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/149603
Kind Code:
A1
Abstract:
This method for producing a thermosetting resin composition has: a desolventizing step for obtaining a second mixture from a first mixture which contains a thermosetting resin, a curing agent, and a slurry containing an inorganic filler and a solvent by removing the solvent at a first desolventizing temperature; and a kneading step for adding a curing accelerator to the second mixture and kneading the second mixture to which the curing accelerator has been added at a first kneading temperature which is lower than the first desolventizing temperature.

Inventors:
YAMAURA MASASHI (JP)
NAKAMURA TAKEHIRO (JP)
HONG CHANGHOON (JP)
KANG DONGCHUL (JP)
HIRAJIMA KATSUYUKI (JP)
NOZAWA HIROSHI (JP)
Application Number:
PCT/JP2022/000277
Publication Date:
July 14, 2022
Filing Date:
January 06, 2022
Export Citation:
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Assignee:
SHOWA DENKO MAT CO LTD (JP)
International Classes:
H01L23/29; B29B7/88; C08K3/013; C08L63/00; C08L101/00; H01L23/31
Domestic Patent References:
WO2011118584A12011-09-29
WO2005038519A12005-04-28
Foreign References:
JP2014080455A2014-05-08
JP2014122292A2014-07-03
JP2008088350A2008-04-17
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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