METHOD FOR REMOVING LINEAR OBJECTS, DEVICE FOR REMOVING LINEAR OBJECTS, AND METHOD FOR PROCESSING ELECTRONIC/ELECTRICAL EQUIPMENT COMPONENT WASTE

WIPO Patent Application WO/2021/177381

A1

Provided are a method for removing linear objects, a device for removing linear objects, and a method for processing electronic/electrical equipment component waste with which make it possible to improve separation efficiency. The method for removing linear objects comprises: arranging a plurality of filters 3 inside a vibration sieve machine 1 adjacent to one another so as to partially overlap one another along the material supply direction, the filters 3 being provided with a plurality of rods 2 extending at intervals along the supply direction and a beam part 21 for supporting the plurality of rods 2 at one ends of the plurality of rods 2, the other ends 2b of the plurality of rods 2 being free ends; arranging a guide 6 below the tip end of the filter 3 positioned on the most downstream side in the supply direction; supplying materials including at least linear objects and plate-like objects to the inside of the vibration sieve machine 1; applying vibration to the filter 3; and sieving linear objects to the lower side of the sieve in the vibration sieve machine 1 and capturing a lump of linear objects by the guide 6, thereby separating the lump of linear objects from the plate-like objects.

AOKI KATSUSHI (JP)

PCT/JP2021/008282

September 10, 2021

March 03, 2021

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JX NIPPON MINING & METALS CORP (JP)

B07B1/12; B07B9/00; B09B5/00

WO2019151350A1	2019-08-08
WO2019151350A1	2019-08-08

JP2019055390A	2019-04-11
JP2009142765A	2009-07-02
JP2020037070A	2020-03-12
JP2015150505A	2015-08-24
JP2015123418A	2015-07-06

AXIS PATENT INTERNATIONAL (JP)

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