Title:
METHOD FOR REPAIRING MOLD, AND MOLD
Document Type and Number:
WIPO Patent Application WO/2021/084727
Kind Code:
A1
Abstract:
[Purpose] To repair an uneven-shaped molding surface in a mold with good precision. [Solution] First, a damaged part on an uneven-shaped molding surface 1a of a mold 1 is filled with a repairing material 2. Next, the uneven-shaped molding surface 1a is remolded by cutting a surface raised by the repairing material 2 by using an endmill 3 having a diameter smaller than that used in making a mold anew. At that time, the rotational deflection of a spindle on which the endmill 3 is installed is measured, and the diameter of the endmill 3 may be selected according to the measured rotational deflection.
Inventors:
HAGA TSUYOSHI (JP)
Application Number:
PCT/JP2019/042957
Publication Date:
May 06, 2021
Filing Date:
October 31, 2019
Export Citation:
Assignee:
IBUKI INC (JP)
International Classes:
B21D37/20; B29C33/74; B22C7/00; B23K9/04; B23K31/00
Foreign References:
| JPS61143806U | 1986-09-05 | |||
| JP2013034997A | 2013-02-21 | |||
| JPH08336844A | 1996-12-24 |
Attorney, Agent or Firm:
KUMEGAWA Masamitsu (JP)
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