METHOD FOR REUSING BASE MATERIAL FOR WIRING BOARDS

Title:

METHOD FOR REUSING BASE MATERIAL FOR WIRING BOARDS

Document Type and Number:

WIPO Patent Application WO/2021/065951

Kind Code:

A1

Abstract:

[Problem] To provide a method which is capable of removing only a cured coating film in a defect part from a base material in cases where a defect is found in a part of the cured coating film during the production of a wiring board wherein the cured coating film is provided on the base material, and which is capable of removing the cured coating film from the base material regardless of the composition of a photosensitive resin composition. [Solution] A method for reusing a base material by removing a part or the entirety of a cured coating film from a wiring board that is provided with the cured coating film on the surface of the base material, said method being characterized in that the cured coating film is formed of a cured product of a photosensitive resin composition, and being also characterized by comprising: a step for irradiating a part or the entirety of the cured coating film with at least one of an active energy ray that is capable of generating active oxygen in an oxygen atmosphere and an active energy ray that is capable of cleaving a C-C carbon bond; and a step for removing the cured coating film in the portion irradiated with the active energy ray by cleaning the wiring board with a solvent.

Inventors:

SHIBATA DAISUKE (JP)
ARAI YASUAKI (JP)
SATO KAZUYA (JP)
WEI XIAOZHU (JP)

Application Number:

PCT/JP2020/037012

Publication Date:

April 08, 2021

Filing Date:

September 29, 2020

Export Citation:

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Assignee:

TAIYO INK MFG CO LTD (JP)

International Classes:

G03F7/004; G03F7/40; G03F7/42; H05K3/28

Domestic Patent References:

WO2016208300A1	2016-12-29
WO2003077291A1	2003-09-18

Foreign References:

JP2015028646A	2015-02-12
JP2008224872A	2008-09-25
JP2002033257A	2002-01-31
JP2016095388A	2016-05-26