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Title:
METHOD FOR SEGMENTING SUBSTRATE HAVING METAL FILM
Document Type and Number:
WIPO Patent Application WO/2019/082724
Kind Code:
A1
Abstract:
Provided is a method with which it is possible to suitably segment a substrate having a metal film. A method for segmenting a substrate having a metal film, the method comprising: a step for forming a scribe line by scribing a first-main-surface side, on which a metal film is provided, at a designated position to be segmented, segmenting the metal film, and extending a vertical crack on the substrate interior along the position to be segmented; and a step for further extending the vertical crack by bringing a breaking bar into contact with the substrate having a metal film from a second-main-surface side, on which the metal film is not provided, thereby segmenting the substrate having a metal film at the position to be segmented.

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Inventors:
MURAKAMI KENJI (JP)
Application Number:
PCT/JP2018/038406
Publication Date:
May 02, 2019
Filing Date:
October 16, 2018
Export Citation:
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Assignee:
MITSUBOSHI DIAMOND IND CO LTD (JP)
International Classes:
H01L21/301; B28D5/00
Foreign References:
JP2014067859A2014-04-17
JPS4897484A1973-12-12
JPH08264488A1996-10-11
JP2014107518A2014-06-09
JP2005223270A2005-08-18
JPH04249113A1992-09-04
JP2012146879A2012-08-02
Other References:
See also references of EP 3703107A4
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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