Title:
METHOD FOR SEPARATING COPPER-COPPER LAMINATE, AND COPPER-COPPER LAMINATE
Document Type and Number:
WIPO Patent Application WO/2023/286711
Kind Code:
A1
Abstract:
The present invention is a method for separating a copper-copper laminate having a first structure in which a first copper conductor film is provided on a joining surface, a second structure in which a second copper conductor film is provided on a joining surface, and a cross-linking layer that includes nanocrystals of copper(II) oxide and that is located between the joining surfaces of the first and second structures, the method for separating a copper-copper laminate involving cooling the cross-linking layer to a temperature equal to or lower than the antiferromagnetic magnetic transition temperature of copper(II) oxide and separating the joining surfaces of the first and second structures. The temperature to which the cross-linking layer is cooled may be lower than the temperature at which the thermal expansion coefficient of at least the copper(II) oxide transitions to a negative value. The nanocrystals of copper(II) oxide included in the cross-linking layer may be derived from a cross-linked substance produced through a vapor-assisted procedure for irradiating the nanocrystals with vacuum-ultraviolet light.
Inventors:
SHIGETOU AKITSU (JP)
Application Number:
PCT/JP2022/027099
Publication Date:
January 19, 2023
Filing Date:
July 08, 2022
Export Citation:
Assignee:
NAT INST MATERIALS SCIENCE (JP)
International Classes:
B09B5/00; B32B7/06; B32B15/01; B32B38/18; B09B101/17
Domestic Patent References:
| WO2016116980A1 | 2016-07-28 |
Foreign References:
| JP2015051542A | 2015-03-19 | |||
| JPH0885830A | 1996-04-02 | |||
| CN101092663A | 2007-12-26 |
Attorney, Agent or Firm:
ASAMURA IP P.C. (JP)
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