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Patent Searching and Data


Title:
METHOD FOR SETTING CONDITION FOR PEEN MOLDING, PEEN MOLDING METHOD, AND DEVICE FOR SETTING CONDITION FOR PEEN MOLDING
Document Type and Number:
WIPO Patent Application WO/2021/070395
Kind Code:
A1
Abstract:
In the past, molding conditions have been set using, as an index, only modification amounts for each region of a member. The method for setting a condition for peen molding according to the present disclosure for achieving the present purpose has: a step (S30) for dividing a model of a member being molded into a plurality of individual regions (S10), and acquiring a preliminary molding shape on the basis of a prescribed preliminary molding condition (S20); a step (S40) for acquiring, with respect to the preliminary molding shape, a divergence amount and a modification amount of the individual regions relative to a set region having a reference shape; a step (S50) for setting a learned model of the preliminary molding condition, the divergence amount, and the modification amount with respect to the preliminary molding shape, and acquiring a relational expression of the preliminary molding condition, the divergence amount, and the modification amount from the learned model; and a step (S70) for performing a calculation by substituting a molding condition into the relational expression, and then setting a molding condition for which the divergence amount, and the difference between the modification amount and a target modification amount, are minimized as an optimal molding condition.

Inventors:
OKAI TAIGA (JP)
KONO AKIRA (JP)
YAMADA TAKESHI (JP)
KOZAKI TAKASHI (JP)
AKANUMA KOSUKE (JP)
KUWANO TOSHIHIRO (JP)
Application Number:
PCT/JP2019/040339
Publication Date:
April 15, 2021
Filing Date:
October 11, 2019
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
B21D31/06; B24C1/10
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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