Title:
METHOD FOR SETTING CONDITION FOR PEEN MOLDING, PEEN MOLDING METHOD, AND DEVICE FOR SETTING CONDITION FOR PEEN MOLDING
Document Type and Number:
WIPO Patent Application WO/2021/070395
Kind Code:
A1
Abstract:
In the past, molding conditions have been set using, as an index, only modification amounts for each region of a member. The method for setting a condition for peen molding according to the present disclosure for achieving the present purpose has: a step (S30) for dividing a model of a member being molded into a plurality of individual regions (S10), and acquiring a preliminary molding shape on the basis of a prescribed preliminary molding condition (S20); a step (S40) for acquiring, with respect to the preliminary molding shape, a divergence amount and a modification amount of the individual regions relative to a set region having a reference shape; a step (S50) for setting a learned model of the preliminary molding condition, the divergence amount, and the modification amount with respect to the preliminary molding shape, and acquiring a relational expression of the preliminary molding condition, the divergence amount, and the modification amount from the learned model; and a step (S70) for performing a calculation by substituting a molding condition into the relational expression, and then setting a molding condition for which the divergence amount, and the difference between the modification amount and a target modification amount, are minimized as an optimal molding condition.
Inventors:
OKAI TAIGA (JP)
KONO AKIRA (JP)
YAMADA TAKESHI (JP)
KOZAKI TAKASHI (JP)
AKANUMA KOSUKE (JP)
KUWANO TOSHIHIRO (JP)
KONO AKIRA (JP)
YAMADA TAKESHI (JP)
KOZAKI TAKASHI (JP)
AKANUMA KOSUKE (JP)
KUWANO TOSHIHIRO (JP)
Application Number:
PCT/JP2019/040339
Publication Date:
April 15, 2021
Filing Date:
October 11, 2019
Export Citation:
Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
B21D31/06; B24C1/10
Foreign References:
JPS5299961A | 1977-08-22 | |||
JP2003191028A | 2003-07-08 | |||
JPS56146672A | 1981-11-14 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
Download PDF:
Previous Patent: LEARNING DEVICE, CLASSIFICATION DEVICE, LEARNING METHOD, AND LEARNING PROGRAM
Next Patent: TERMINAL AND COMMUNICATION METHOD
Next Patent: TERMINAL AND COMMUNICATION METHOD