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Patent Searching and Data


Title:
MI SENSOR AND METHOD FOR MANUFACTURING MI SENSOR
Document Type and Number:
WIPO Patent Application WO/2020/003815
Kind Code:
A1
Abstract:
This MI sensor 1A is provided with an amorphous wire 2, an insulator layer 3 formed on the outer circumferential surface of the amorphous wire 2, and an X-axis coil 6X, a Y-axis coil 6Y, and a Z-axis coil 6Z which are formed spirally on the outer circumferential surface of the insulator layer 3. The X-axis coil 6X, the Y-axis coil 6Y, and the Z-axis coil 6Z are formed on conductive layers, and the X-axis coil 6X, the Y-axis coil 6Y, and the Z-axis coil 6Z are disposed in directions perpendicular to each other.

Inventors:
KUSUDA TATSUFUMI (JP)
Application Number:
PCT/JP2019/020076
Publication Date:
January 02, 2020
Filing Date:
May 21, 2019
Export Citation:
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Assignee:
NIDEC READ CORP (JP)
International Classes:
G01R33/02
Foreign References:
JP2001004726A2001-01-12
JP2009229101A2009-10-08
JP2016194531A2016-11-17
JP2006047267A2006-02-16
JP2006300906A2006-11-02
JPH1174582A1999-03-16
JP2002286823A2002-10-03
CN104820196A2015-08-05
Attorney, Agent or Firm:
YANAGINO Takao et al. (JP)
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