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Title:
MICRO LED CHIP AND MANUFACTURING METHOD THEREFOR, AND DISPLAY MODULE AND TERMINAL
Document Type and Number:
WIPO Patent Application WO/2024/087973
Kind Code:
A1
Abstract:
The embodiments of the present application relate to the technical field of chips. Provided are a micro light-emitting diode (LED) chip and a manufacturing method therefor, and a display module and a terminal, which are used for ameliorating the phenomenon of light crosstalk of a micro LED display screen. The micro LED chip comprises a substrate, a light-shielding structure, a plurality of micro LED devices, metal retaining walls and a plurality of color conversion layers, wherein the plurality of micro LED devices are electrically connected to the substrate; the light-shielding structure is located between adjacent micro LED devices; one color conversion layer covers one micro LED device; and the metal retaining walls are located between adjacent color conversion layers, and can prevent light emitted by the micro LED devices from being incident on the adjacent color conversion layers, so as to reduce light crosstalk. The metal retaining walls can further enable more light, which is from the micro LED devices and is incident on the color conversion layers, to be subjected to color conversion, thereby improving the conversion efficiency of the color conversion layers.

Inventors:
YANG LEI (CN)
YANG YINA (CN)
ZHANG LI (CN)
JIANG FULONG (CN)
ZHANG FENGMEI (CN)
Application Number:
PCT/CN2023/120851
Publication Date:
May 02, 2024
Filing Date:
September 22, 2023
Export Citation:
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Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01L33/50; H01L27/15
Domestic Patent References:
WO2020258898A12020-12-30
Foreign References:
CN112242468A2021-01-19
CN112748609A2021-05-04
CN115132715A2022-09-30
Attorney, Agent or Firm:
BEIJING ZBSD PATENT & TRADEMARK AGENT LTD. (CN)
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