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Title:
MICRO LIGHT-EMITTING DIODE CHIP AND DISPLAY PANEL
Document Type and Number:
WIPO Patent Application WO/2021/063035
Kind Code:
A1
Abstract:
Provided are a micro light-emitting diode chip and a display panel. The micro light-emitting diode chip comprises a first-type semiconductor layer, a light-emitting layer, a second-type semiconductor layer, a first-type electrode layer, a second-type electrode layer, an insulating passivation layer, and a filler layer. The first-type semiconductor layer comprises a first protrusion and a second protrusion. A recessed region is formed between the first protrusion and the second protrusion. The light-emitting layer and the second-type semiconductor layer are stacked on the second protrusion. The first-type electrode layer covers the first protrusion and a portion of the recessed region. The insulating passivation layer covers a sidewall of the second protrusion, a portion of a surface of the second-type semiconductor layer away from the light-emitting layer and at least a portion of the first-type electrode layer positioned in the recessed region. The second-type electrode layer covers the insulating passivation layer and a portion of the surface of the second-type semiconductor layer away from the light-emitting layer. The filler layer is at least partially filled in the recessed region.

Inventors:
GUO ENQING (CN)
TIAN WENYA (CN)
WANG CHENGGONG (CN)
Application Number:
PCT/CN2020/097496
Publication Date:
April 08, 2021
Filing Date:
June 22, 2020
Export Citation:
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Assignee:
CHENGDU VISTAR OPTOELECTRONICS CO LTD (CN)
International Classes:
H01L33/00; H01L33/38; H01L33/44; H01L33/46; H01L33/48; H01L33/62
Foreign References:
CN107134470A2017-09-05
CN208637453U2019-03-22
CN104810439A2015-07-29
CN106463580A2017-02-22
Attorney, Agent or Firm:
LEADER PATENT & TRADEMARK FIRM (CN)
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