Title:
MICROCHANNEL CHIP
Document Type and Number:
WIPO Patent Application WO/2023/032896
Kind Code:
A1
Abstract:
A microchannel chip (1) comprises: a resin substrate (2) manufactured using a mold formed by direct carving machining, and having a channel groove (21) on one surface thereof; and a covering material (3) bonded to the resin substrate (2) so as to cover the channel groove (21). In the resin substrate (2), the roundness of a corner portion (2c) formed at a boundary between a bonded surface (2a) to the covering material (3) and an inner side surface (2b) defining the channel groove (21) is equal to or less than R 5 μｍ.
Inventors:
YAKUMARU KOSUKE (JP)
Application Number:
PCT/JP2022/032367
Publication Date:
March 09, 2023
Filing Date:
August 29, 2022
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
B81B1/00; B29C33/38; B29C45/26; G01N37/00
Foreign References:
| JP2015199340A | 2015-11-12 | |||
| JP2013022534A | 2013-02-04 | |||
| JPH07125206A | 1995-05-16 | |||
| JPH0957847A | 1997-03-04 | |||
| JP2009019127A | 2009-01-29 | |||
| JP2021141725A | 2021-09-16 | |||
| JP2015199340A | 2015-11-12 |
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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