Title:
MICROFLUIDIC CHIP AND METHOD FOR MANUFACTURING MICROFLUIDIC MICROCHIP
Document Type and Number:
WIPO Patent Application WO/2023/008398
Kind Code:
A1
Abstract:
Provided are a microfluidic chip and a method for producing the same, with which it is possible to suppress the occurrence of poor bonding between a resin layer forming a flow path and a cover material, and to suppress deformation of the flow path. A microfluidic chip (1) comprises: a substrate (10); a barrier layer (11) which is composed of a resin material and is provided on the substrate (10) to form a flow path; and a cover layer (12) which is provided to a surface on the reverse side of the barrier layer (11) from the substrate (10). The modulus of elasticity of the barrier layer (11) is in the range of 1 MPa to 10 GPa, inclusive.
Inventors:
HAKII HIDEMITSU (JP)
FUKUGAMI NORIHITO (JP)
FUKUGAMI NORIHITO (JP)
Application Number:
PCT/JP2022/028683
Publication Date:
February 02, 2023
Filing Date:
July 26, 2022
Export Citation:
Assignee:
TOPPAN INC (JP)
International Classes:
G01N35/08; B01D19/00; B01J19/00; B05D3/06; B81B1/00; B81C1/00; B81C3/00; G01N37/00; G03F7/40
Domestic Patent References:
| WO2013035651A1 | 2013-03-14 |
Foreign References:
| JP2020056790A | 2020-04-09 | |||
| JPH09262084A | 1997-10-07 | |||
| JPH09257748A | 1997-10-03 | |||
| JP2006136990A | 2006-06-01 | |||
| JP2013044528A | 2013-03-04 |
Attorney, Agent or Firm:
HIROSE Hajime et al. (JP)
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