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Patent Searching and Data


Title:
MICROWAVE FURNACE USING COMPOSITE DIELECTRIC HEATING PLATE
Document Type and Number:
WIPO Patent Application WO/2019/194348
Kind Code:
A1
Abstract:
The present invention relates to a microwave furnace using a composite dielectric heating plate which applies, to a furnace, a composite dielectric that absorbs microwaves and generates heat and can, thereby, substantially increase energy efficiency, operational reliability and durability of a device, and the like. Provided according to the present invention is a microwave furnace using a composite dielectric heating plate, comprising: a furnace main body (21) having a heating chamber (26); a magnetron (22) connected to the furnace main body (21) so as to generate microwaves; a waveguide (25) extending from the magnetron (22) to the furnace main body (21) so as to transfer the microwaves into the heating chamber (26); and a composite dielectric heating plate (30) in the form of a panel provided inside the heating chamber (26) and containing a plurality of dielectrics so as to absorb the microwaves, and heat.

Inventors:
CHUNG CHUN SIL (KR)
LEE HYUN GU (KR)
Application Number:
PCT/KR2018/005352
Publication Date:
October 10, 2019
Filing Date:
May 10, 2018
Export Citation:
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Assignee:
SEJITECH CO LTD (KR)
International Classes:
F27B9/06; F27B9/34; F27D1/00; F27D99/00
Foreign References:
JP2010139217A2010-06-24
KR101786720B12017-10-17
KR101389727B12014-04-28
US20150215996A12015-07-30
KR20050080036A2005-08-11
Attorney, Agent or Firm:
LEE, Dae Sun (KR)
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