Title:
MILLIMETER WAVE MODULE, AND METHOD FOR MANUFACTURING MILLIMETER MODULE
Document Type and Number:
WIPO Patent Application WO/2019/207830
Kind Code:
A1
Abstract:
According to the present invention, conductor patterns (21, 31) for signals are formed respectively on a first main surface (101) and a second main surface (102) of an insulating substrate (100). Conductor patterns (222, 322) for grounding are formed respectively on the first main surface (101) and the second main surface (102). A first conductive member (41) is formed in the insulating substrate (100), and makes the conductor patterns (21, 31) for signals electrically conductive in the thickness direction. A second conductive member (42) is formed on the insulating substrate (100), and is connected to the conductor patterns (222, 322) for grounding. A dielectric member (43) is disposed between the first conductive member (41) and the second conductive member (42), contacts the first conductive member (41) and the second conductive member (42), and has a dielectric constant that is different from the dielectric constant of the insulating substrate (100).
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Inventors:
KATO TAKATOSHI (JP)
Application Number:
PCT/JP2018/043654
Publication Date:
October 31, 2019
Filing Date:
November 28, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01P1/04; H01P5/08; H01P11/00; H05K1/02; H05K3/46
Foreign References:
| JP2000068713A | 2000-03-03 | |||
| US20060022312A1 | 2006-02-02 | |||
| JPH11150371A | 1999-06-02 | |||
| JP2016100579A | 2016-05-30 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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