MODULAR INDIRECT EVAPORATIVE COOLING SYSTEM, DATA CENTER AND SPRAYING ASSEMBLY

WIPO Patent Application WO/2022/134105

A1

A modular indirect evaporative cooling system (10), a data center (60) and a spraying assembly (40). The modular indirect evaporative cooling system (10) comprises a housing (20) and a heat exchange device (20a) arranged inside the housing (20); the heat exchange device (20a) comprises an evaporative heat exchange core (30) and a spraying assembly (40); the spraying assembly (40) comprises a liquid inlet pipe (41), a spraying arm (42) and nozzles (44); the liquid inlet pipe (41) is rotatably connected to the spraying arm (42), and a liquid outlet (411) of the liquid inlet pipe (41) is in communication with the spraying arm (42); a plurality of nozzles (44) are arranged on the spraying arm (42) at intervals, and the nozzles (44) face towards a first surface (31) of the evaporative heat exchange core (30); and at least one end of the spraying arm (42) is provided with at least one rotating spraying opening (421) which is used for driving, when spraying a liquid outwards, the spraying arm (42) to rotate. The invention solves the problems of the existing indirect evaporative cooling systems of a complicated structure, high maintenance cost, a poor refrigeration effect, and energy waste.

YANG ZONGHAO (CN)
LI MALIN (CN)

PCT/CN2020/139703

June 30, 2022

December 25, 2020

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HUAWEI DIGITAL POWER TECH CO LTD (CN)

F24F5/00; F28F25/06; F24F13/30

CN210801476U	2020-06-19
CN210980977U	2020-07-10
CN201983693U	2011-09-21
CN202216613U	2012-05-09
JPS58174261U	1983-11-21
CN101644468A	2010-02-10
CN212205718U	2020-12-22
CN2289611Y	1998-09-02

LEADER PATENT & TRADEMARK FIRM (CN)

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