Title:
MODULE AND ELECTRONIC EQUIPMENT
Document Type and Number:
WIPO Patent Application WO/2019/220821
Kind Code:
A1
Abstract:
The module according to one embodiment of the present invention is provided with: a first substrate having a first wiring pattern; and a second substrate that is affixed to the first substrate and that has a second wiring pattern having a wiring density different from that of the first wiring pattern, wherein the first substrate and/or the second substrate exhibits visible light transparency.
Inventors:
IGARASHI TAKAHIRO (JP)
YANAGAWA SHUSAKU (JP)
YANAGAWA SHUSAKU (JP)
Application Number:
PCT/JP2019/015556
Publication Date:
November 21, 2019
Filing Date:
April 10, 2019
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H05K3/46; H01Q1/38; H01Q23/00
Domestic Patent References:
| WO2002003499A1 | 2002-01-10 |
Foreign References:
| JP2007081554A | 2007-03-29 | |||
| JP2007173759A | 2007-07-05 | |||
| JP2014165529A | 2014-09-08 |
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
Download PDF: