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Patent Searching and Data


Title:
MODULE SUBSTRATE, HIGH-FREQUENCY MODULE, AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/199475
Kind Code:
A1
Abstract:
Provided are a module substrate, a high-frequency module, and a communication device capable of reducing the possibility of air remaining in solder. This module substrate (1a) comprises a base material (mounting substrate 100), a first pad (pad 111), a second pad (pad 112), and a resist (120). The substrate has a first main surface (101) and a second main surface (102) facing each other. The first pad is provided on the first main surface (101). The second pad is provided on the first main surface (101) and adjacent to the first pad. The resist (120) is provided on the first main surface (101). The resist (120) has a first opening (opening 131), a second opening (opening 132), and a third opening (opening 141). The first opening exposes a part of the first pad. The second opening exposes a part of the second pad. The third opening connects the first opening and the second opening.

Inventors:
YANASE SHOGO
Application Number:
PCT/JP2020/040942
Publication Date:
October 07, 2021
Filing Date:
October 30, 2020
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/34
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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