Title:
Moisture Curable Hot-melt Adhesive Composition
Document Type and Number:
WIPO Patent Application WO/2019/109328
Kind Code:
A1
Abstract:
Disclosed is a moisture curable hot-melt adhesive composition, comprising a silane modified polymer, a ethylenically unsaturated carboxylic acid graft modified polymer, and a tackifying agent. The moisture curable hot-melt adhesive composition provides a cured product exhibiting improved bonding strength and excellent reworkability at room temperature.
Inventors:
XING WENTAO (CN)
GUO HUI (CN)
LOW YEW-GUAN (CN)
QIU XUEYU (CN)
GUO HUI (CN)
LOW YEW-GUAN (CN)
QIU XUEYU (CN)
Application Number:
PCT/CN2017/115195
Publication Date:
June 13, 2019
Filing Date:
December 08, 2017
Export Citation:
Assignee:
HENKEL AG & CO KGAA (DE)
HENKEL CHINA CO LTD (CN)
HENKEL CHINA CO LTD (CN)
International Classes:
C09J201/10; C09J143/04; C09J151/06; C09J171/02; C09J175/00
Domestic Patent References:
| WO1996010615A1 | 1996-04-11 |
Foreign References:
| US20140027056A1 | 2014-01-30 | |||
| CN104981527A | 2015-10-14 | |||
| US6121354A | 2000-09-19 |
Attorney, Agent or Firm:
NTD PATENT AND TRADEMARK AGENCY LIMITED (CN)
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