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Title:
MOISTURE-CURABLE HOT-MELT ADHESIVE COMPOSITION, BONDED OBJECT, AND GARMENT
Document Type and Number:
WIPO Patent Application WO/2020/217574
Kind Code:
A1
Abstract:
A moisture-curable hot-melt adhesive composition is disclosed. The moisture-curable hot-melt adhesive composition comprises: a urethane prepolymer which includes a polymer chain comprising a structural unit derived from a polyol and a structural unit derived from a polyisocyanate and has two or more isocyanate groups; and a modified urethane prepolymer which includes a polymer chain comprising a structural unit derived from a polyol and a structural unit derived from a polyisocyanate and has one or more isocyanate groups modified with a castor oil monool.

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Inventors:
QU SHUJIE (JP)
KOMIYA SOUICHIROU (JP)
IMAI TAKUYA (JP)
MAGOME KAZUYUKI (JP)
KAMEI JUNICHI (JP)
Application Number:
PCT/JP2019/045681
Publication Date:
October 29, 2020
Filing Date:
November 21, 2019
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
A41H43/04; C08G18/10; C09J175/04; D06M15/572
Foreign References:
JP2016160344A2016-09-05
JP2016074996A2016-05-12
JP2016121351A2016-07-07
JPH05171035A1993-07-09
JP2008248018A2008-10-16
US20160137892A12016-05-19
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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