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Title:
MOLD CLEANING COMPOUND AND METHOD FOR CLEANING SEMICONDUCTOR PACKAGING MOLD
Document Type and Number:
WIPO Patent Application WO/2017/018690
Kind Code:
A1
Abstract:
Provided are: a mold cleaning compound, which is a compound for cleaning a semiconductor packaging mold and has a spheroidal or cylindrical shape; and a mold cleaning method using the same.

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Inventors:
LEE SUNG YULL (KR)
Application Number:
PCT/KR2016/007537
Publication Date:
February 02, 2017
Filing Date:
July 12, 2016
Export Citation:
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Assignee:
FINE CHEMICAL CO LTD (KR)
International Classes:
H01L21/02; B29C33/72; H01L23/29; H01L23/31
Foreign References:
KR20150056189A2015-05-26
KR20130098657A2013-09-05
JP3270246B22002-04-02
KR20150085355A2015-07-23
KR20020085713A2002-11-16
Attorney, Agent or Firm:
KWAK, Hyun Kyu et al. (KR)
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