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Patent Searching and Data


Title:
MOLD CLEANING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2017/078131
Kind Code:
A1
Abstract:
Provided is a mold cleaning system with which dirt can be efficiently removed while preventing damage to a molding surface, without the need for manual labor, even from a mold having a molding surface with a complicated shape. When a mold 11 is being cleaned, three-dimensional image data of a molding surface 12 of the mold 11 are acquired by a camera 3, movements of arms 6a and 6b are controlled by a control device 7 on the basis of the acquired image data, and, while a laser head 4 is moved along the molding surface 12, dirt X attached to the molding surface 12 is removed by irradiation of laser light L supplied from a laser oscillator 2. For a specific site, cleaning is performed using a relatively small laser head 4b and optionally a relatively large laser head 4a. Alternatively, cleaning is performed using a laser head 4 having a variable laser irradiation width allowing an appropriate laser irradiation width to be used for each cleaning site.

Inventors:
MATSUMURA KENSUKE (JP)
WATANABE MASAYUKI (JP)
MIYAZAKI YUSAKU (JP)
Application Number:
PCT/JP2016/082777
Publication Date:
May 11, 2017
Filing Date:
November 04, 2016
Export Citation:
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Assignee:
YOKOHAMA RUBBER CO LTD (JP)
International Classes:
B29C33/72; B23K26/02
Domestic Patent References:
WO2015199113A12015-12-30
Foreign References:
US6369353B12002-04-09
JP2005532170A2005-10-27
JP2005205833A2005-08-04
Other References:
See also references of EP 3372370A4
Attorney, Agent or Firm:
Seiryu Patent Professional Corporation et al. (JP)
Clear stream international patent business corporation (JP)
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