Title:
MOLD CLEANING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2017/078131
Kind Code:
A1
Abstract:
Provided is a mold cleaning system with which dirt can be efficiently removed while preventing damage to a molding surface, without the need for manual labor, even from a mold having a molding surface with a complicated shape. When a mold 11 is being cleaned, three-dimensional image data of a molding surface 12 of the mold 11 are acquired by a camera 3, movements of arms 6a and 6b are controlled by a control device 7 on the basis of the acquired image data, and, while a laser head 4 is moved along the molding surface 12, dirt X attached to the molding surface 12 is removed by irradiation of laser light L supplied from a laser oscillator 2. For a specific site, cleaning is performed using a relatively small laser head 4b and optionally a relatively large laser head 4a. Alternatively, cleaning is performed using a laser head 4 having a variable laser irradiation width allowing an appropriate laser irradiation width to be used for each cleaning site.
Inventors:
MATSUMURA KENSUKE (JP)
WATANABE MASAYUKI (JP)
MIYAZAKI YUSAKU (JP)
WATANABE MASAYUKI (JP)
MIYAZAKI YUSAKU (JP)
Application Number:
PCT/JP2016/082777
Publication Date:
May 11, 2017
Filing Date:
November 04, 2016
Export Citation:
Assignee:
YOKOHAMA RUBBER CO LTD (JP)
International Classes:
B29C33/72; B23K26/02
Domestic Patent References:
| WO2015199113A1 | 2015-12-30 |
Foreign References:
| US6369353B1 | 2002-04-09 | |||
| JP2005532170A | 2005-10-27 | |||
| JP2005205833A | 2005-08-04 |
Other References:
See also references of EP 3372370A4
Attorney, Agent or Firm:
SEIRYU PATENT PROFESSIONAL CORPORATION et al. (JP)
Download PDF: