Title:
MOLD FORMATION METHOD AND MOLD
Document Type and Number:
WIPO Patent Application WO/2019/160058
Kind Code:
A1
Abstract:
The objective of the present invention is to provide a mold formation method and a mold prepared using the method, with which it is possible to prepare a large-surface-area mold at a low cost and with good precision. The mold is formed with: an adhesive layer formation step in which an adhesive layer 3 is formed on the surface 11 of a base material 1, or on the back surface of a unit mold 2 on which a prescribed pattern is formed; a disposition step in which a plurality of unit molds 2 are disposed on the base material 1 with the adhesive layer 3 interposed therebetween; and a fixing step in which the adhesive layer 3 is cured and the unit molds 2 are fixed to the adhesive layer 3.
Inventors:
TANABE DAIJI (JP)
TANAKA SATORU (JP)
TANAKA SATORU (JP)
Application Number:
PCT/JP2019/005420
Publication Date:
August 22, 2019
Filing Date:
February 14, 2019
Export Citation:
Assignee:
SCIVAX CORP (JP)
International Classes:
H01L21/027; B29C33/30; B29C59/02
Domestic Patent References:
| WO2013031460A1 | 2013-03-07 | |||
| WO2011049097A1 | 2011-04-28 |
Foreign References:
| JP2014162111A | 2014-09-08 | |||
| JP2012148481A | 2012-08-09 | |||
| JP2012253303A | 2012-12-20 | |||
| JP2011176321A | 2011-09-08 | |||
| JP2009078521A | 2009-04-16 | |||
| JP2012253236A | 2012-12-20 | |||
| JP2016072403A | 2016-05-09 |
Attorney, Agent or Firm:
OKUDA Noritsugu (JP)
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