Title:
MOLD AND METHOD FOR MANUFACTURING MOLD
Document Type and Number:
WIPO Patent Application WO/2021/182551
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a mold which does not need to be coated with a release material and which has few limitations on pattern shape. A mold is constituted from a substrate 1 and a pattern layer 2 which has a fine pattern and which is formed on the substrate 1 from a resin having as main components a fluoroacrylate and at least one of polydimethylsiloxane and an acrylate. In the pattern layer 2, the elastic modulus E of the resin is adjusted to 20-240 MPa. An interface layer for enhancing adhesion of the pattern layer 2 to the substrate 1 may be formed between the substrate 1 and the pattern layer 2.
Inventors:
SAKAMORI SHIGENORI (JP)
NAKAMURA TOMONORI (JP)
IMADA ATSUYA (JP)
TANAKA SATORU (JP)
NAKAMURA TOMONORI (JP)
IMADA ATSUYA (JP)
TANAKA SATORU (JP)
Application Number:
PCT/JP2021/009683
Publication Date:
September 16, 2021
Filing Date:
March 10, 2021
Export Citation:
Assignee:
SCIVAX CORP (JP)
International Classes:
B29C33/38; B29C59/02
Foreign References:
| JP2010505264A | 2010-02-18 | |||
| JP2017135304A | 2017-08-03 | |||
| JP2014194960A | 2014-10-09 | |||
| US20100151387A1 | 2010-06-17 |
Attorney, Agent or Firm:
OKUDA Noritsugu (JP)
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