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Title:
MOLD AND PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/180070
Kind Code:
A1
Abstract:
The present application relates to the technical field of electronic devices, and particularly relates to a mold and a processing method. The mold comprises a mold cavity, an insert, and a mold core; the mold cavity is of an integrated structure; the insert is mounted at an end portion of the mold cavity and forms a cavity with the mold cavity; at least a portion of the mold core extends into the cavity and works in conjunction with the cavity for processing a product; the mold cavity is provided with a first air channel, and cool air enters the cavity by means of the first air channel, so that a gap is formed between the product in the cavity and the mold cavity. The mold cavity is of an integrated structure, and therefore, a parting line in the prior art would not be formed on the processed product, and the appearance of the product would not be affected. Moreover, the mold cavity is provided with the first air channel, and the cool air enters the cavity by means of the first air channel, so that the product is cooled and contracted, and a gap is formed between the product and the inner wall of the mold cavity, thereby facilitating release of the product from the mold cavity and improving the appearance effect and the integrity of the product. The present application solves the problems in the prior art that the appearance effects of processed products are poor and that the appearance integrity is prone to damage.

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Inventors:
CHENG LIANGJUN (CN)
FENG JIANCHENG (CN)
CAI SHENGYOU (CN)
XIAO JIANJUN (CN)
WU WEIJIE (CN)
Application Number:
PCT/CN2021/079742
Publication Date:
September 16, 2021
Filing Date:
March 09, 2021
Export Citation:
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Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
B29C45/73; B29C45/26
Foreign References:
CN102729410A2012-10-17
JPH0524080A1993-02-02
JP2000238103A2000-09-05
Attorney, Agent or Firm:
UNI-INTEL PATENT AND TRADEMARK LAW FIRM (CN)
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