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Patent Searching and Data


Title:
MOLD-RELEASE FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2021/079746
Kind Code:
A1
Abstract:
A mold-release film for use in production of semiconductor packages, said mold-release film having: a base material layer having a tensile elastic modulus of no more than 150 MPa at a temperature of 170°C and a restoration rate of at least 70% at a temperature of 170°C; and a mold-release layer arranged on one surface of the base material layer and including resin particles. Also provided is a mold-release film for use in the production of semiconductor packages, that has: a base material layer and a mold-release layer arranged on one surface of the base material layer and including resin particles; a tensile elastic modulus of no more than 150 MPa at a temperature of 170°C; and a restoration rate of at least 70% at a temperature of 170°C.

Inventors:
SUZUKI MASAHIKO (JP)
TAMURA RYO (JP)
Application Number:
PCT/JP2020/038125
Publication Date:
April 29, 2021
Filing Date:
October 08, 2020
Export Citation:
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Assignee:
SHOWA DENKO MAT CO LTD (JP)
International Classes:
B32B27/00; B29C33/68; H01L21/56
Foreign References:
JP2016092272A2016-05-23
JP2017205902A2017-11-24
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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