Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MOLD RELEASE FILM AND METHOD FOR PRODUCING LAMINATE
Document Type and Number:
WIPO Patent Application WO/2019/107544
Kind Code:
A1
Abstract:
Provided is a mold release film that can transfer a dip-bump structure onto the surface of an adhesive film such that air trapped when the adhesive film onto which the dip-bump structure has been transferred is attached to an adherend can be released appropriately, and the dip-bump structure on the adhesive film after the attachment is hardly visible. The mold release film according to the present invention has a configuration wherein the bumps in the dip-bump structure in plan view have an irregular shape. The area percentage of the bumps in the surface of the dip-bump structure is 10%-90%, the maximum height difference between the bumps and dips is at least 0.5 μm, and the bumps are continuous in plan view.

Inventors:
SASAKI NOBUAKI (JP)
SATO YOSHIHIDE (JP)
Application Number:
PCT/JP2018/044186
Publication Date:
June 06, 2019
Filing Date:
November 30, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
B32B3/30; C09J7/40
Domestic Patent References:
WO2013129080A12013-09-06
WO2015152352A12015-10-08
Foreign References:
JP2010209189A2010-09-24
JP2011162751A2011-08-25
JP2006070273A2006-03-16
JP2004277534A2004-10-07
JP2016188344A2016-11-04
Other References:
See also references of EP 3718762A4
HIDEKI YAMAMOTO: "Basics, Applications, and Calculation Methods of SP Value", JOHOKIKO CO., LTD.
Attorney, Agent or Firm:
TAKEUCHI, ICHIZAWA & ASSOCIATES (JP)
Download PDF: