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Patent Searching and Data


Title:
MOLD RELEASE FILM FOR MOLDING OF RESIN SHEET
Document Type and Number:
WIPO Patent Application WO/2022/138484
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a mold release film that has a mold release layer having particularly excellent smoothness and release properties, and therefore, allows molding of an ultra-thin resin sheet, particularly an ultra-thin ceramic green sheet, without defect. This mold release film for molding of a resin sheet comprises: a polyester film as a base; and a mold release layer. The polyester film has a surface layer A that contains substantially no inorganic particles. The mold release layer is provided on the surface layer A. The mold release layer is made of a cured mold release layer formation composition. The mold release layer formation composition contains at least a cationic-curable polydimethylsiloxane (a). The regional surface roughness (Sa) of the mold release layer is at most 2 nm. The number of protrusions having a height of at least 10 nm present on a surface of the mold release layer is at most 200/mm2.

Inventors:
SHIGENO KENTO (JP)
SHIBATA YUSUKE (JP)
KUSUBA HIROAKI (JP)
NAKATANI MITSUHARU (JP)
Application Number:
PCT/JP2021/046720
Publication Date:
June 30, 2022
Filing Date:
December 17, 2021
Export Citation:
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Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B27/00; B28B1/30; B32B7/06; B32B27/36
Domestic Patent References:
WO2019073875A12019-04-18
Foreign References:
JP2004351626A2004-12-16
JP2003305806A2003-10-28
JP2017200761A2017-11-09
JP2016030343A2016-03-07
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