MOLD RELEASE LAYER, MOLDED ARTICLE COMPRISING MOLD RELEASE LAYER, AND MOLD RELEASE AGENT

Title:

MOLD RELEASE LAYER, MOLDED ARTICLE COMPRISING MOLD RELEASE LAYER, AND MOLD RELEASE AGENT

Document Type and Number:

WIPO Patent Application WO/2016/098779

Kind Code:

A1

Abstract:

　Provided are a mold release layer having a surface free energy of 30mJ/m2-60mJ/m2 and a normal release force of 50mN/50mm-400mN/50mm, and a mold release layer having a normal release force of 50mN/50mm-400mN/50mm, and having a post-heating release force twice that of the normal release force.

More Like This:

JP2013194205	BASE GENERATOR, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN-FORMING MATERIAL COMPOSED OF THE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RELIEF PATTERN BY USING THE PHOTOSENSITIVE RESIN COMPOSITION, AND ARTICLE
JP6322040	Permeability imparting agent

Inventors:

NISHIO AKIKO (JP)
HONGO YUKI (JP)

Application Number:

PCT/JP2015/085103

Publication Date:

June 23, 2016

Filing Date:

December 15, 2015

Export Citation:

Click for automatic bibliography generation Help

Assignee:

TOYO BOSEKI (JP)

International Classes:

C09K3/00; B29C33/62; B32B27/00; C08F220/18

Domestic Patent References:

WO2012020673A1

2012-02-16

Foreign References:

JP2010144046A	2010-07-01
JP2007002092A	2007-01-11
JP2012011657A	2012-01-19
JP2013141793A	2013-07-22
JP2004346213A	2004-12-09
JP2012087210A	2012-05-10
JP2013076048A	2013-04-25

Attorney, Agent or Firm:

Fukami Patent Office, p. c. (JP)
Patent business corporation Fukami patent firm (JP)

Download PDF:

View/Download PDF PDF Help

Previous Patent: EPITAXIAL WAFER FOR SEMICONDUCTOR TRANSISTORS, AND SEMICONDUCTOR TRANSISTOR

Next Patent: MICRONEEDLE PATCH, METHOD FOR MANUFACTURING SAME, AND APPARATUS FOR MANUFACTURING MICRONEEDLE ARRAY