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Title:
MOLD FOR SUPPORT MEMBER OF OPTICAL RECEPTACLE BODY, SUPPORT MEMBER AND MANUFACTURING METHOD FOR SAME, AND OPTICAL RECEPTACLE AND OPTICAL MODULE
Document Type and Number:
WIPO Patent Application WO/2019/230638
Kind Code:
A1
Abstract:
[Problem] To provide a mold which is for forming an optical receptacle, saves space, and can increase speed and capacity. [Solution] This mold for forming a support member that supports a plurality of optical receptacles for optically coupling a photoelectric conversion element and the end faces of an optical transmission body has: a first mold for forming an attachment surface of the support member to which the optical receptacle body is attached; a second mold for forming the surface on the reverse side of the support member from the attachment surface; and a third mold that is held in at least one among the first mold and the second mold and is for forming a support member-side attachment structure to which the body-side attachment structure of the optical receptacle body is fitted. A plurality of holding parts, which can selectively hold the third mold and a fourth mold a surface of which has approximately the same height as the surface around the holding part, are formed on at least one among the first mold and the second mold. The third mold is held in at least a portion of the plurality of the holding parts. The plurality of holding parts can be switched between holding the third mold and holding the fourth mold.

Inventors:
KON AYANO (JP)
Application Number:
PCT/JP2019/020863
Publication Date:
December 05, 2019
Filing Date:
May 27, 2019
Export Citation:
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Assignee:
ENPLAS CORP (JP)
International Classes:
G02B6/42; B29C33/44; G02B6/32
Domestic Patent References:
WO2017068843A12017-04-27
Foreign References:
JP2008040264A2008-02-21
US20130287406A12013-10-31
CN103885140A2014-06-25
CN103777286A2014-05-07
JPH04204409A1992-07-24
JPH0560823U1993-08-10
JP2002311299A2002-10-23
JPH1142684A1999-02-16
JP2016534412A2016-11-04
JP2015040883A2015-03-02
Attorney, Agent or Firm:
ISODA Shiro (JP)
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